Drill positioning holes for the corner shooting machine, align the through-hole with the PAD outer shape inspection ring corresponding to 1243, and shoot carbon powder imprints on the FPC multi-layer board surface to detect the relative position between the PAD outer shape inspection ring and the through-hole. The process of all multi-layer boards should first prepare the inner layer of the circuit, and then perform a one-time composite with the copper foil of the two outer layers. When laminating multi-layer boards, there should be exhaust holes in the ineffective area. The expansion and contraction of the inner layer board, after sorting the data of the multi-layer board after laminating the protective film and the expansion and contraction data of the single-sided board after pressing the protective film, the protective film of the single panel will shrink by 0.8% to ensure that the size is around 100% in the later part. The inner layer circuit is corrected according to X4Y8.

Technical specifications:

1. Correction of the inner layer of the multi-layer board. According to the current measured data, X-3Y3 is used, and the ideal drill band for the second drill of the multi-layer board is around 1:1;

2. The electroplating conditions for multi-layer boards are specified as a one-time plating of 1.7ASD * 10MIN with a thickness of about 4 microns, a second copper plating of 1.7ASD * 20MIN with a thickness of about 7.5 microns, and a total copper thickness below the lower limit of 10 microns for operation.

● The total weight and volume of flexible assembly are reduced by 70% compared to traditional circular wire harness methods.

● It can be moved, bent, and twisted without damaging the wires, and can comply with different shapes and special packaging sizes.

● Flexible circuits can withstand millions of dynamic bends and are well suited for continuous or periodic motion in interconnected systems, becoming a part of the final product functionality.

Rigid Flex

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