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After drying the COP film coated with thermosetting adhesive or TPI
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Keyword：
adhesive
thermosetting
inspection
Product details
After drying the COP film coated with thermosetting adhesive or TPI, a layer of copper is pressed onto the surface of the thermosetting adhesive or TPI. The purpose of pressing copper foil is to use high temperature and high pressure to bond the copper foil and COP film together through thermosetting adhesive or TPI. After thermosetting, peel strength inspection and thermal stress testing are carried out; Soft board materials based on COP are produced according to the FPC production process to create various types of soft boards for 5G communication in high-frequency and high-speed fields.
Technical indicators:
1. The thickness of copper foil is 12-75um, and the process conditions for pressing copper foil are: 180-240 ℃, pressing time: 2-5 minutes;
2. The peel strength inspection requires a peel strength greater than 0.5Kgf/cm, and the inspection method refers to IPC-TM-650N0.2.4.9;
3. The testing conditions for thermal stress testing are 260 degrees Celsius, 3 thermal shocks (tin bleaching), and a requirement of no delamination or bubbles for 10 seconds each time.
Description of technical progressiveness:
1. By adopting automation control, the high level of automation achieves integrated production control, synchronizing production and quality monitoring, ensuring product quality to the greatest extent possible and improving labor efficiency.
2. Providing excellent electrical performance can meet the design needs of smaller and higher density installations, and also help reduce assembly processes and enhance reliability.
3. By freely bending, winding, and folding, it can be arranged according to spatial layout requirements, and can move and expand freely in three-dimensional space, thus achieving the integration of component assembly and wire connection.
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After drying the COP film coated with thermosetting adhesive or TPI
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